The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates 2nd Edition nach Ventec International Group anzeigen

The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates 2nd Edition

von Ventec International Group

Softcover
Flexibler, laminierter Hochglanz-Einband
Menge:
Die MwSt. wird an der Kasse aufgeschlagen.
Über das Buch
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
Eigenschaften und Details
  • Hauptkategorie: Fachbücher
  • Projektoption: 15×23 cm
    Seitenanzahl: 68
  • ISBN
    • Softcover: 9780999864838
  • Veröffentlichungsdatum: März 22, 2018
  • Sprache English
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Über den Autor
I-007eBooks
IPC Publishing Group, Inc.
Bannockburn, IL

IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

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